CLUSTER SYSTEMS

for Research, Develop­ment & Production

The cluster systems CS200 and CS300 are modular coating systems suitable for both highly flexible or highly productive processes in the development and production of applications in semiconductors, optics, and photovoltaics. They are specifically designed for processing substrates with a diameter of 200 mm or 300 mm (including G12 wafers).

Thus, our cluster systems are the ideal choice for the development of new coating technologies and the production of layers with specific properties and high reproducibility. Applications include sensors and through-silicon vias (TSV) for 3D advanced packaging technology in the semiconductor industry. Furthermore, the CS300 is used in the development of new solar cell generations such as TOPCon and perovskite tandem.

Thanks to their great flexibility, the cluster systems help reduce your operating costs. They can be individually configured for different tasks: around the central transfer chamber, up to seven process chambers and one or more load locks can be accommodated. All chambers are separated from each other both in terms of vacuum and control technology.

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