Power Electronics

Vacuum Coating Equipment for Metallization

The demand for power electronics continues to grow, driven by major developments such as renewable‑energy systems and electric mobility.

Manufacturing the key components for these technologies requires base plates or printed circuit boards with high thermal stability and excellent electrical conductivity. One established approach is to apply an adhesion layer to ceramic substrates, which can then be laminated with copper foil.

Another advanced method uses thick oxynitride dielectric barrier layers that provide exceptional electrical insulation.

Our modular vacuum‑coating systems are engineered specifically for producing these critical components, ensuring reliable, high‑quality metallization processes.