Printed Circuit Boards

Coating Equipment for Seed Layers in Semi-additive Production

Modern generations of printed circuit boards feature highly intricate structures only a few micrometers wide, mirroring the miniaturization trends seen in the semiconductor industry.

To manufacture these fine features, PCB producers must rely on precise and reliable technologies. Our modular vacuum coating systems are engineered specifically for semi‑additive (SAP) PCB production and can achieve structure widths below 30 micrometers.

These systems deposit tightly adhering titanium and copper seed layers that are essential for subsequent electroplating steps. They are suitable for panels, flexible PCBs, and flexible electrodes, giving you broad versatility and enhanced manufacturing capability.