Printed Circuit Boards
Coating Equipment for Seed Layers in Semi-additive Production

New generations of printed circuit boards have structures of only a few micrometers. This development follows the same trend in the semiconductor industry.

As a manufacturer of printed circuit boards, you need additional technologies to create these structures. For the semi-additive (SAP - PCB) production of printed circuit boards with a structure width of less than 30 micrometers, we offer modular vacuum coating systems.

These systems allow you to deposit well adherent nucleated layers of titanium and copper for subsequent electroplating. They are also suitable for panels, flexible printed circuit boards and flexible electrodes.

Would you like to learn more? Then click on the content below or contact us directly.

Highly productive system platform

based on extensive process know-how

Easy adaptation to new processes & requirements

due to flexibly configurable equipment

Cost-efficient equipment

due to fully automated concept

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CONTACT
Trade fairs
30.04.2023 - 04.05.2023
SPIE Defense Orlando 2023

Booth: 1621
Orlando, Gaylord Palms Resort & Convention Center

08.05.2023 - 11.05.2023
SVC Washington 2023

Booth: 420
Washington (DC), Gaylord National Resort & Convention Center

20.06.2023 - 22.06.2023
Sensors Converge Santa Clara 2023

Santa Clara, Convention Center

21.06.2023 - 23.06.2023
VIMF 2023

Booth: 152
Binh Duong, World Trade Center Binh Duong New City

19.09.2023 ä 21.09.2023
V2023

Dresden, Internationales Congress Center

Contact persons
Dr. Frank Hinze

Di­rec­tor Mod­u­lar Process Sys­tems VON ARDENNE GmbH