Printed Circuit Boards
Coating Equipment for Seed Layers in Semi-additive Production

New generations of printed circuit boards have structures of only a few micrometers. This development follows the same trend in the semiconductor industry.

As a manufacturer of printed circuit boards, you need additional technologies to create these structures. For the semi-additive (SAP - PCB) production of printed circuit boards with a structure width of less than 30 micrometers, we offer modular vacuum coating systems.

These systems allow you to deposit well adherent nucleated layers of titanium and copper for subsequent electroplating. They are also suitable for panels, flexible printed circuit boards and flexible electrodes.

Would you like to learn more? Then click on the content below or contact us directly.

Highly productive system platform

based on extensive process know-how

Easy adaptation to new processes & requirements

due to flexibly configurable equipment

Cost-efficient equipment

due to fully automated concept

Equipment
Perspective view of a horizontal VON ARDENNE coating system.
HISSHorizontal Coating SystemLearn more
Perspective view of a vertical VON ARDENNE coating system.
VISSVertical Coating SystemLearn more
Technologies
Magnetron SputteringKey Technology from In-house Development & ManufacturingLearn more
Support

Engineering
Simulation . Sampling . Layout

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Perspective view of a VON ARDENNE sampling and testing equipment.

Technology & Application Center
Sampling . Development . Scaling

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Service
Customer Portal . Spare Parts . Trainings

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Media
Customer Portal "myVA" Now Available

It's here: the myVA Customer Portal. VON ARDENNE has developed it with the aim of simplifying interactions, providing valuable insights and increasing…

CONTACT
10.06.2025 - 12.06.2025
GPD Finnland 2025

Tampere, Finland

Presentation

07.10.2025 - 09.10.2025
Semicon West 2025

Phoenix, AZ, USA

Phoenix Convention Center

Booth 6180

SALES Contact

Am Hahnweg 8
01328 Dresden
Germany

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