Advanced Packaging

Pioneering Vacuum Deposition Equipment for Wafer or Panel-Level Substrates

There are various strategies for advanced packaging, which involves the efficient and compact integration of multiple chips to enhance overall system performance.

As electronic systems grow more intricate, the integration of numerous integrated circuits becomes essential. This complexity increases the demands on both conductive and insulating layers, necessitating a careful optimization of substrates and available space to ensure cost-effective manufacturing of these solutions.

The materials used and the processes for their application are evolving, becoming more sophisticated and requiring advanced platforms to tackle the intricate metallization challenges posed by high aspect ratio structures. This is where we excel: driving innovation in materials and devices on wafer or panel substrates with precision measured in sub-nanometers.