Lift-off Processes

Vacuum Coating Equipment for Metallization

Every electrical system relies on proper electrical connections. In back-end applications, these connections are established through a nuanced process that merges a two-dimensional thin-film approach with careful photolithographic masking.

After the application of the coating, the masked areas are effectively lifted away, enabling the creation of small structures with remarkable efficiency. Achieving this requires optimal layer properties, excellent coverage of pertinent areas, and the preservation of the photoresist integrity.

To support these processes, we provide advanced vacuum coating systems for metallization. Our solutions accommodate various metal deposition needs across different applications, offering options both with and without adhesion promoters, as well as temperature treatment capabilities.