Advanced Panel-Level Packaging

Coating Equipment for Three-Dimensional Structures

With advanced packaging, the boundaries of the semiconductor backend processes of packaging and PCB manufacturing are merging.

Increasingly complex electrical systems are being manufactured in three-dimensional structures. The requirements for the conductive and insulating layers are becoming higher and the manufacturing sizes of the panels larger in order to be able to produce cost-effectively.

To manufacture these systems, specially adapted coating equipment is required. And this is exactly what we can offer you.

Would you like to learn more? Then click on the content below or contact us directly.