Advanced Panel Level Packaging
Coating Equipment for Three-Dimensional Structures

With advanced packaging, the boundaries of the semiconductor backend processes of packaging and PCB manufacturing are merging.

Increasingly complex electrical systems are being manufactured in three-dimensional structures. The requirements for the conductive and insulating layers are becoming higher and the manufacturing sizes of the panels larger in order to be able to produce cost-effectively.

To manufacture these systems, specially adapted coating equipment is required. And this is exactly what we can offer you.

Would you like to learn more? Then click on the content below or contact us directly.

Highly productive system platform

based on extensive process know-how

Easy adaptation to new processes & requirements

due to flexibly configurable equipment

Cost-efficient equipment

due to fully automated concept

Support
Media
Successful kick off: Sustainability Network Dresden meets at VON ARDENNE

On November 22, 2022, VON ARDENNE hosted the first meeting of the Sustainability Network Dresden, which was launched on the initiative of the Dresden…

Digital Solutions for Resource Efficiency in Glass Coating

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Automated process stabilization for glass coating - with VA PROCESSMASTER

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VON ARDENNE at the AVS 2022 - Key Takeaways

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Coating Equipment for Precision Optical Coatings

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What makes electron-beam assisted PVD coating so special?

The ability to coat a multitude of surfaces with specific materials is extremely important for providing technologies and products for our everyday…

Perovskite PV: Status, Importance and Manufacturing Technologies

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What is the most efficient way to melt refractory and reactive metals?

Refractory and reactive metals have extraordinary properties such as resistance to heat, corrosion, and wear. These are extremely interesting…

Magnetron Sputtering: How It Began and How VON ARDENNE Became a Technology Pioneer

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VIDEO: Future Trends in Photovoltaics | Cleantech Conversations

In this first episode of our new series Cleantech Conversations, we have interviewed Jonathan Gifford, Editor in Chief at pv magazine about future…

CONTACT
Trade fairs
30.04.2023 - 04.05.2023
SPIE Defense Orlando 2023

Booth: 1621
Orlando, Gaylord Palms Resort & Convention Center

08.05.2023 - 11.05.2023
SVC Washington 2023

Booth: 420
Washington (DC), Gaylord National Resort & Convention Center

20.06.2023 - 22.06.2023
Sensors Converge Santa Clara 2023

Santa Clara, Convention Center

21.06.2023 - 23.06.2023
VIMF 2023

Booth: 152
Binh Duong, World Trade Center Binh Duong New City

19.09.2023 ä 21.09.2023
V2023

Dresden, Internationales Congress Center

Contact persons
Dr. Frank Hinze

Di­rec­tor Mod­u­lar Process Sys­tems VON ARDENNE GmbH