Lift-off Processes
Vacuum Coating Equipment for Metallization

Every electrical system needs electrical connections. In back-end applications, they are created by combining a two-dimensional thin-film process with prior photolithographic masking.

The masked areas are removed after coating, lifted off, so to speak. This makes it possible to create small structures very effectively. The prerequisite for this is appropriate layer properties and good coverage of relevant areas and no damage to the photoresist.

For these processes, we offer you  vacuum coating systems for metallization. They are suitable for deposition solutions of different metals for different applications with and without adhesion promoter, and with temperature treatment.

Would you like to learn more? Then click on the content below or contact us directly.

Easy adaptation to new processes & requirements

due to flexibly configurable equipment

Floor space is saved

due to compact design

Good lift-off performance

due to optimal layer properties

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CONTACT
06.05.2024 - 09.05.2026
SVC Annual Conference 2024

Booth: nn
Chicago Hilton, Illinois, USA

Dr. Frank Hinze

Industry ManagerVON ARDENNE GmbH

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